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Sapphire Laser hakowa, yankan inji
Bayanin samfurin Picosecond Laser Micromachining Tsarin: Radium Laser Picosecond Laser Micromachining Tsarin amfani da duniya manyan Jamus 140W High i
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Bayanan samfurin
Picosecond Laser Micro sarrafawa tsarin:
Sea Radium Laser Picosecond Laser Micromachining Tsarin Amfani da Duniya Manyan Jamus 140W High ikon infrared da kore haske biyu bandwidth fitarwa picosecond karfi laser, cikakken cimma high daidaito da high inganci, high tauraro m kayan micro processing, zai iya dacewa da duk wani hakowa, yankan, engraving aiki na zafi m da high tauraro m kayan, picosecond laser aiki lokacin saboda pulse width musamman m, laser mita musamman high, ultra-high peak ikon, kusan babu zafi wayarwa samar, don haka aiki lokacin da zafi tasiri m kayan ba tare da wani zafi tasiri da damuwa samar, picosecond laser aiki ne na yanzu da mafi m tsara na uku daidaitaccen sanyi aiki hanya, shi ne ci gaban nan gaba trends na laser masana'antu iya amfani da ƙarfafa gilashi, ultra-thin karfe zane-zane, yumbu zane-zane, sapphire zane-zane da sauran duk kayan micro hakowa da kuma m yankan aiki, a halin yanzu manyan aikace-aikace da wayar hannu gilashi murfin yankan, High-grade agogo masana'antu daidaito gear sassa yankan hakowa, semiconductor microelectronics masana'antu kewaye engraving da yankan.
Fasali na inji:
1.HL-650 Ultra-sauri picosecond laser micromachining tsarin ya yi amfani da Multi-axis laser sarrafawa software da Sea Radium Laser m R & D, iya goyon bayan ①CCD gani atomatik manufa ②. XY dandamali daidaito motsi babban girman lokaci guda seamless splicing Laser Laser da kuma bincike oscilloscope daidaitacce aiki aiki tare da aiki, lokaci guda aiki 650mm * 650mm kewayon, shekaru goma na software fasahar tarawa, balaga da kuma kwanciyar hankali software fasahar, edita aiki mai ƙarfi, zai iya cimma babban zane-zane atomatik yanke ko hannu yanke zaɓi, splicing daidaito har zuwa ≤3um.
2.Strong software fasali goyon bayan daban-daban gani Positioning halaye: kamar gicciye, m zagaye, m zagaye, gicciye da m zagaye, L-irin madaidaiciyar kusurwa gefe, image halaye maki Positioning gani, sosai m lokacin aiki da ba tare da fixtures yanayin Positioning!
3. HL-650 picosecond laser micromachining tsarin ya yi amfani da Jamus samar da 355nm.532nm..1064nm uku-band daidaitaccen picosecond laser, mafi girman laser iko 50w pulse nisa kawai 10ps, ultra gajeren pulse width sa laser aiki lokacin da babu zafi gudanarwa samar, don haka aiki lokacin da zafi tasiri mafi m kayan ba tare da wani zafi tasiri da damuwa samar, picosecond laser aiki ya kasance daidai sanyi aiki hanya, za a iya amfani da takarda, gilashi, karfe, yumbu, sapphire da sauran kayan aiki, ko da a fashewa da sauran kayan aiki lokacin da ba za a faru fashewa.
Yi amfani da masana'antu:
Wayar hannu murfin, gani gilashi, sapphire substrate, ultra-thin karfe tabar kayan, yumbu substrate da sauran kayan micropore hakowa da kuma m yankan. takamaiman aikace-aikace masana'antu kamar: daidaito firikwensin ultra-micro sassa, high-grade agogo kayan aiki, mota injin nozzle micro rami hakowa, wayar hannu gilashi murfin hakowa yankan da LED ko high zafin jiki juriya PCB yumbu substrate kewaye kwamitin diamita 0.1mm ko fiye da kananan rami hakowa da kuma siffar yankan.
Main fasaha sigogi:
Yankan hakowa Sample Chart:
Picosecond Laser Micro sarrafawa tsarin:
Sea Radium Laser Picosecond Laser Micromachining Tsarin Amfani da Duniya Manyan Jamus 140W High ikon infrared da kore haske biyu bandwidth fitarwa picosecond karfi laser, cikakken cimma high daidaito da high inganci, high tauraro m kayan micro processing, zai iya dacewa da duk wani hakowa, yankan, engraving aiki na zafi m da high tauraro m kayan, picosecond laser aiki lokacin saboda pulse width musamman m, laser mita musamman high, ultra-high peak ikon, kusan babu zafi wayarwa samar, don haka aiki lokacin da zafi tasiri m kayan ba tare da wani zafi tasiri da damuwa samar, picosecond laser aiki ne na yanzu da mafi m tsara na uku daidaitaccen sanyi aiki hanya, shi ne ci gaban nan gaba trends na laser masana'antu iya amfani da ƙarfafa gilashi, ultra-thin karfe zane-zane, yumbu zane-zane, sapphire zane-zane da sauran duk kayan micro hakowa da kuma m yankan aiki, a halin yanzu manyan aikace-aikace da wayar hannu gilashi murfin yankan, High-grade agogo masana'antu daidaito gear sassa yankan hakowa, semiconductor microelectronics masana'antu kewaye engraving da yankan.
Fasali na inji:
1.HL-650 Ultra-sauri picosecond laser micromachining tsarin ya yi amfani da Multi-axis laser sarrafawa software da Sea Radium Laser m R & D, iya goyon bayan ①CCD gani atomatik manufa ②. XY dandamali daidaito motsi babban girman lokaci guda seamless splicing Laser Laser da kuma bincike oscilloscope daidaitacce aiki aiki tare da aiki, lokaci guda aiki 650mm * 650mm kewayon, shekaru goma na software fasahar tarawa, balaga da kuma kwanciyar hankali software fasahar, edita aiki mai ƙarfi, zai iya cimma babban zane-zane atomatik yanke ko hannu yanke zaɓi, splicing daidaito har zuwa ≤3um.
2.Strong software fasali goyon bayan daban-daban gani Positioning halaye: kamar gicciye, m zagaye, m zagaye, gicciye da m zagaye, L-irin madaidaiciyar kusurwa gefe, image halaye maki Positioning gani, sosai m lokacin aiki da ba tare da fixtures yanayin Positioning!
3. HL-650 picosecond laser micromachining tsarin ya yi amfani da Jamus samar da 355nm.532nm..1064nm uku-band daidaitaccen picosecond laser, mafi girman laser iko 50w pulse nisa kawai 10ps, ultra gajeren pulse width sa laser aiki lokacin da babu zafi gudanarwa samar, don haka aiki lokacin da zafi tasiri mafi m kayan ba tare da wani zafi tasiri da damuwa samar, picosecond laser aiki ya kasance daidai sanyi aiki hanya, za a iya amfani da takarda, gilashi, karfe, yumbu, sapphire da sauran kayan aiki, ko da a fashewa da sauran kayan aiki lokacin da ba za a faru fashewa.
Yi amfani da masana'antu:
Wayar hannu murfin, gani gilashi, sapphire substrate, ultra-thin karfe tabar kayan, yumbu substrate da sauran kayan micropore hakowa da kuma m yankan. takamaiman aikace-aikace masana'antu kamar: daidaito firikwensin ultra-micro sassa, high-grade agogo kayan aiki, mota injin nozzle micro rami hakowa, wayar hannu gilashi murfin hakowa yankan da LED ko high zafin jiki juriya PCB yumbu substrate kewaye kwamitin diamita 0.1mm ko fiye da kananan rami hakowa da kuma siffar yankan.
Main fasaha sigogi:
sigogi Model |
HL-650 |
Laser iri | 355nm 523nm 1064nm Uku-band Rapid50W 10ps Laser |
Max Laser ikon | 50W |
Laser mafi ƙarancin mayar da hankali | 15um (355nm guda block m yanki 200mm × 200mm) 25um 1064um Laser guda Max yanki |
Laser daya Max aiki kewayon | 67 × 67mm 15um waya fadi 170 × 170mm 40um waya fadi |
Laser aiki layi splicing daidaito | ≤±3um |
Laser aiki gudun | 100-3000mm / s daidaitawa |
Max motsi gudun dandali na XY | 800mm / s 1G hanzari |
Maimaita daidaito na dandamali na XY | ≤±1um |
Daidaito na XY Platform | ≤±3um |
CCD Matsayi Daidaito | ≤±3um |
Wutar lantarki | 5kw/Ac220V/50Hz |
Cooling hanyar | thermostat ruwa sanyaya |
Girman bayyanar | 2300mm×2000mm×1950mm |
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